theil.com

World Class Provider of Micro Module Assembly and Thick Film and Thin Film Substrate Foundry Services Provider - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975. Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the late


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theil.com

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Keywords

DBC, CMOS Image Sensor, Image Sensor, BSI wafer, SiP, MEMS assembling and test, Power Module, Microwave Module, RF module, and DPC on AlN for Thermoelectric Module, CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules

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